American Precision Dicing
Wafer singulation and marking for small to medium projects
Since 1999
About American Precision Dicing
American Precision Dicing processes wafers and other hard, brittle materials using precision mechanical saws with diamond blades. Its supported materials include silicon, glass, ceramics, sapphire and silicon carbide. The company serves research laboratories, universities, startups and production customers from San Jose, California. The company describes a workflow from project discussion and incoming-material inspection through mounting, dicing, washing, quality inspection and shipment. It also offers wafer coring and downsizing and laser marking for wafers, individual dies and compatible industrial parts. Its laser-marking service focuses on prototypes through low-volume work.
Founding year and industries from the company's own website, Nov 6, 2026
Services
Wafer dicing
Diamond-blade dicing of silicon and other hard, brittle wafer materials for research, prototyping and small to medium projects.
Laser marking
Permanent identification marks on wafers, individual dies and compatible metal or polymer parts, with prototype and low-volume process support.
Certifications
As American Precision Dicing states them. Fabrication AI has not checked them with the issuer; ask the shop for the certificate.
Locations
Business address
642 Giguere Ct
San Jose, CA 95133Company location details for San Jose business location
Company sources
- Home of Precision Wafer Dicing Services | APD Inc. Scrolling Image Slider Signage Signage Location Speaker Five Stars Five Stars Signage Signage Location Speaker Five Stars Five Stars Mail Phone Locat
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- Contact Us | American Precision Dicing Inc. Mail Phone Location APD Quick Links
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- Wafer Dicing Services | American Precision Dicing APD Quick Links
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- Precision Laser Marking | American Precision Dicing Inc APD Quick Links
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- About American Precision Dicing | Wafer Dicing San Jose
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