All manufacturers
American Dicing logo

American Dicing

Wafer singulation for semiconductor and specialty substrates

Since 1993

Representative illustration of a silicon wafer frame beside enclosed dicing equipment

About American Dicing

American Dicing provides precision dicing and scribing for microelectronic and miniature fabrication work. Beyond silicon wafers, its advertised material range includes quartz, sapphire, glass and ceramic substrates. Automated and manual saws support process development, custom cutting paths, beveling and production work, with job-specific blade and tape selection. The company also describes die sorting and packaging services at its Liverpool, New York, operation. Engineers can contact the team to discuss substrate material, geometry, thickness and handling requirements; this profile links the explicitly sourced wafer-dicing service.

  • Defense
  • Aerospace
  • Medical devices
  • Energy
  • Electronics
  • Research and labs

Founding year and industries from the company's own website, Nov 6, 2026

Services

AI illustration of wafer dicing.

Wafer dicing

Dicing, scribing, slotting, multi-depth cutting and beveling for semiconductor wafers and specialty substrates, with job-specific process development.

Locations

Company sources